Bambu Lab PC is a premium engineering polycarbonate filament designed for 3D printing technical, functional, and heat-resistant parts. This material combines excellent mechanical strength, high impact resistance, and thermal stability, making it an ideal choice for engineering components, working prototypes, and parts operating under demanding conditions.
PC filament delivers low shrinkage and reliable dimensional stability, yielding high-quality prints with consistent geometry. Parameters are embedded in RFID for seamless integration with AMS systems.
Features
• Engineering polycarbonate filament for high-temperature and mechanically stressed models
• High tensile strength and impact resistance
• Excellent heat resistance and dimensional stability
• Low warp and predictable print quality
• Stable material flow and consistent layer precision
• Filament diameter: 1.75 mm ± 0.03 mm
• AMS compatible (RFID optimized)
• Recommended dry storage before use
Printing recommendations
• Thoroughly dry the filament before printing (~80 °C for 8 hours)
• Store sealed with desiccant (< 20 % RH)
• Apply adhesive on the build plate for better first-layer adhesion
• Enclosed chamber printing reduces warping and improves results
Recommended print settings
• Nozzle temperature: 250–270 °C
• Bed temperature: 90–110 °C
• Maximum printing speed: < 300 mm/s
• Printing technology: FDM
Physical properties
• Density: ≈ 1.20 g/cm³
• Vicat softening temperature: ≈ 119 °C
• Heat deflection temperature: ≈ 117 °C
• Melting temperature: ≈ 228 °C
• High impact resistance and rigidity
• Low shrinkage and excellent dimensional stability
Applications
• Functional and technical parts
• Load-bearing mechanical components
• Prototypes and end-use parts for high-temperature environments
• Automotive and industrial applications
• Parts requiring heat resistance and impact strength